Advanced Silicon Wafer-Based Solar Cells: Enhancing Efficiency, Yield, and Cost-Effectiveness

Jas Ong

Jas Ong

Materials Engineering Fellow
Organization logoOpen Avenues Foundation
Mondays at 7:00 P.M. ET / 4:00 P.M. PT
8 weeks, 2-3 hours per week
BeginnerNo prior experience required

Description

Application timeline

Applications openApril 14, 2025
Applications deadlineMay 8, 2025
Application results releasedWeek of May 26, 2025
Project start dateWeek of June 9, 2025
Project end dateWeek of July 28, 2025

What you will learn

Project workshops

Prerequisites

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About the Fellows

Jas Ong

Jas Ong

Materials Engineering Fellow
Organization logoOpen Avenues Foundation
LinkedInVisit Jas's LinkedIn

Jas Ong (Ong Cheng Shian) is a Materials Engineering Fellow at Open Avenues Foundation, where he leads educational projects focused on solar cell manufacturing, process optimization, and advanced materials engineering. In this role, he collaborates with university students to bridge the gap between academia and industry by providing hands-on experience in cutting-edge solar technology. He is also a Process & Technology Deputy Director at ES Foundry Corp., South Carolina, where he is responsible for process optimization, efficiency improvements, and the development of advanced manufacturing techniques in the solar energy sector. His work involves managing engineering teams, implementing cost-reduction strategies, and overseeing the development of next-generation solar cells. With over 13 years of experience in solar cell manufacturing and materials engineering, he has been involved in multiple new fab startups and has played a crucial role in advancing PERC, HJT, and TOPCon solar cell technologies. His expertise spans efficiency improvements, yield optimization, and cost-reduction initiatives, making him a leader in the field. He holds a Bachelor’s Degree in Materials Engineering from Universiti Sains Malaysia (USM). A fun fact about him is that he has recently developed a passion for fishing, enjoying the tranquility and challenge it brings outside of his technical work.